This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC.
IPC J-STD-002D:2013 History
IPC J-STD-002E:2017
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IPC J-STD-002D:2013
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IPC J-STD-002C:2007
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IPC J-STD-002B:2003
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