Contains industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated through-holes. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance.
IPC J-STD-003:1992 History
IPC J-STD-003C-WAM1&2:2017
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IPC J-STD-003C-WAM1:2014
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IPC J-STD-003C:2013
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IPC J-STD-003B:2007
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IPC J-STD-003A:2003
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IPC J-STD-003:1992
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