IPC J-STD-005:1995

Requirements for Soldering Pastes, Includes Amendment 1 (2007)

Association Connecting Electronics Industries , 01/01/1995

Publisher: IPC

File Format: PDF

$31.00$62.00

Description

Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material's performance in the manufacturing process). Supersedes QQ-S-571.

Published: 01/01/1995

Pages: 38

File Size: 1 file , 320 KB

Language: English

Note: This product is unavailable in Russia, Ukraine, Belarus