IPC J-STD-609:2007

This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of those assemblies that are assembled with lead-containing or lead free solder, components that have lead-containing or lead free second level interconnect terminal finishes and materials, the maximum component temperature not to be exceeded during assembly or rework processing, the base materials used in the PCB construction, including those PCBs that use halogen-free resin, the surface finish of PCBs and the conformal coating on PCBAs. This document may be purchased in hard copy or downloaded at no charge. 12 pages. Released June 2007.