This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision G contains over 500 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, lead free solders, assembly processes, base materials and high speed/high frequency boards. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching.
IPC T-50G:2003 History
IPC T-50N:2021
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IPC T-50M:2015
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IPC T-50K:2013
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IPC T-50J:2011
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IPC T-50H:2008
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IPC T-50G:2003
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