This specification covers the engineering requirements for electroless deposition of a nickel-thallium-boron or nickel-boron coating on various substrates and properties of the deposit.
This process has been used typically to provide hard, ductile, wear-resistant surface for operation in service up to 1000 degrees F (538 degrees C), to provide uniform build up on complex shapes, and to enhance solderability of surfaces, but usage is not limited to such applications. This process is not generally recommended for materials subject to overtempering or high temperature embrittlement when exposed to the post-plating heat treatment of 675 \mDF (357 \mDC) for 90 minutes.
This process has been used typically to provide hard, ductile, wear-resistant surface for operation in service up to 1000 degrees F (538 degrees C), to provide uniform build up on complex shapes, and to enhance solderability of surfaces, but usage is not limited to such applications. This process is not generally recommended for materials subject to overtempering or high temperature embrittlement when exposed to the post-plating heat treatment of 675 \mDF (357 \mDC) for 90 minutes.
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