IEC 60191-6-3 Ed. 1.0 b:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

International Electrotechnical Commission , 09/29/2000

Publisher: IEC

File Format: PDF

$72.00$145.00

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

Published: 09/29/2000

Pages: 34

File Size: 1 file , 320 KB

Language: English, French

Note: This product is unavailable in Ukraine, Russia, Belarus

$72.00 $145.00

$52.00 $104.00

$95.00 $190.00

$44.00 $88.00

$117.00 $234.00

$25.00 $51.00