IEC 60191-6-3 Ed. 1.0 en:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

International Electrotechnical Commission , 09/29/2000

Publisher: IEC

File Format: PDF

$52.00$104.00

Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.

Published: 09/29/2000

Pages: 17

File Size: 1 file , 180 KB

Language: English

Note: This product is unavailable in Ukraine, Russia, Belarus

$72.00 $145.00

$52.00 $104.00

$139.00 $278.00

$91.00 $183.00

$136.00 $272.00

$72.00 $145.00