Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
IEC 61190-1-2 Ed. 1.0 b:2002 History
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IEC 61190-1-2 Ed. 2.0 b:2007
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IEC 61190-1-2 Ed. 1.0 b:2002
$33.00 $67.00
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