IEC 61190-1-2 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

International Electrotechnical Commission , 03/22/2002

Publisher: IEC

File Format: PDF

$33.00$67.00

Description

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Published: 03/22/2002

Pages: 35

File Size: 1 file , 1.3 MB

Language: English, French

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