IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.
IEC 61190-1-2 Ed. 3.0 b:2014 History
IEC 61190-1-2 Ed. 3.0 b:2014
$95.00 $190.00
IEC 61190-1-2 Ed. 2.0 en:2007
$48.00 $97.00
IEC 61190-1-2 Ed. 2.0 b:2007
$60.00 $121.00
IEC 61190-1-2 Ed. 1.0 b:2002
$33.00 $67.00
More Standards PDF
IEC 60774-5 Ed. 1.0 en:2004
$164.00 $328.00
IEC 60444-7 Ed. 1.0 en:2004
$25.00 $50.00
IEC 60050-482 Ed. 1.0 b:2004
$208.00 $417.00
IEC 61300-2-48 Ed. 1.0 b:2004
$23.00 $46.00