Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
IEC 61191-3 Ed. 1.0 b:1998 History
IEC 61191-3 Ed. 2.0 b:2017
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IEC 61191-3 Ed. 1.0 b:1998
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