IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
IEC 61191-3 Ed. 2.0 en:2017 History
IEC 61191-3 Ed. 2.0 b:2017
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IEC 61191-3 Ed. 2.0 en:2017
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IEC 61191-3 Ed. 1.0 b:1998
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