IEC 63055 Ed. 2.0 en:2023

Format for LSI-Package-Board Interoperable design

International Electrotechnical Commission , 10/01/2023

Publisher: IEC

File Format: PDF

$256.00$512.00


This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.

IEC 63055 Ed. 2.0 en:2023 History

IEC 63055 Ed. 2.0 en:2023

IEC 63055 Ed. 2.0 en:2023

$256.00 $512.00

IEC 63055 Ed. 1.0 en:2016

IEC 63055 Ed. 1.0 en:2016

$256.00 $512.00

More Standards PDF

IEC 60806 Ed. 2.0 b:2022

IEC 60806 Ed. 2.0 b:2022

$25.00 $51.00

IEEE 1901b-2021

IEEE 1901b-2021

$29.00 $59.00

IEC /IEEE 63195-1 Ed. 1.0 b:2022
ICC IEBC-2021 Commentary

ICC IEBC-2021 Commentary

$55.00 $111.00