Updated & ANSI Approved! This standard identifies the classification level of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. This standard now covers components to be processed at higher temperatures for lead-free assembly. It is used to determine what classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment and/or repair operation. Developed by IPC and JEDEC.
IPC J-STD-020B:2002 History
IPC J-STD-020E:2015
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IPC J-STD-020D-1:2008
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IPC J-STD-020D:2007
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IPC J-STD-020C:2004
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IPC J-STD-020B:2002
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IPC J-STD-020A:1999
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