Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC.
IPC J-STD-020D-1:2008 History
IPC J-STD-020E:2015
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IPC J-STD-020D-1:2008
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IPC J-STD-020D:2007
$48.00 $97.00
IPC J-STD-020C:2004
$48.00 $97.00
IPC J-STD-020B:2002
$48.00 $97.00
IPC J-STD-020A:1999
$43.00 $86.00
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