Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
IPC J-STD-033C-1:2014 History
IPC J-STD-033D:2018
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IPC J-STD-033C-1:2014
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IPC J-STD-033C:2012
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IPC J-STD-033B:2005
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IPC J-STD-033:1999
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