IPC J-STD-033D:2018

Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

Association Connecting Electronics Industries , 03/01/2018

Publisher: IPC

File Format: PDF

$50.00$101.00

Description

IPC J-STD-033D PDF

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.

Published: 03/01/2018

Pages: 32

File Size: 1 file , 2.4 MB

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