IPC J-STD-033D PDF
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.IPC J-STD-033D:2018 History
IPC J-STD-033D:2018
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IPC J-STD-033C-1:2014
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IPC J-STD-033C:2012
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IPC J-STD-033B:2005
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IPC J-STD-033:1999
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