The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
IEC 62137-1-2 Ed. 1.0 b:2007 History
IEC 62137-1-2 Ed. 1.0 b:2008
$43.00 $87.00
IEC 62137-1-2 Ed. 1.0 en:2007
$40.00 $81.00
IEC 62137-1-2 Ed. 1.0 b:2007
$72.00 $145.00
More Standards PDF
IEC 60904-5 Amd. 1 Ed. 2.0 b:2022
$25.00 $51.00
IEC 62148-22 Ed. 1.0 b:2023
$95.00 $190.00
IEC 62606 Amd.2 Ed. 1.0 b:2017
$110.00 $221.00
IEEE 2621.3-2022 /UL 2621-3-2022
$29.00 $59.00