The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
IEC 62137-1-2 Ed. 1.0 b:2008 History
IEC 62137-1-2 Ed. 1.0 b:2008
$43.00 $87.00
IEC 62137-1-2 Ed. 1.0 en:2007
$40.00 $81.00
IEC 62137-1-2 Ed. 1.0 b:2007
$72.00 $145.00
More Standards PDF
IEC 61338-1-5 Ed. 1.0 b:2015
$72.00 $145.00
IEC 61000-4-13 Ed. 1.2 b:2015
$186.00 $373.00
IEC 61400-27-1 Ed. 1.0 b:2015
$187.00 $375.00
IEC 60393-5 Ed. 3.0 b:2015
$139.00 $278.00