The test method is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
IEC 62137-1-2 Ed. 1.0 en:2007 History
IEC 62137-1-2 Ed. 1.0 b:2008
$43.00 $87.00
IEC 62137-1-2 Ed. 1.0 en:2007
$40.00 $81.00
IEC 62137-1-2 Ed. 1.0 b:2007
$72.00 $145.00
More Standards PDF
IEC 60512-11-14 Ed. 2.0 en:2003
$18.00 $36.00
IEC 61754-6-1 Ed. 1.0 en:2003
$18.00 $36.00
IEEE 82-2002
$48.00 $97.00
IEC 60695-11-2 Ed. 1.0 b:2003
$71.00 $143.00